1 surmount tm 8 m pin diodes rohs compliant rev. v1 madp - 042xx8 - 13060 series advanced: data sheets contain information regarding a product m/a - com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a - com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. m/a - com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. features ? surface mount ? no wirebonds required ? rugged silicon - glass construction ? silicon nitride passivation ? polymer scratch protection ? low parasitic capacitance and inductance ? high average and peak power handling ? rohs compliant description this device is a silicon, glass pin diode surmount chip fabricated with m/a - com techs patented hmic tm proc- ess. this device features two silicon pedestals embedded in a low loss, low dispersion glass. the diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. selective backside metallization is applied producing a surface mount device. this vertical topology provides for exceptional heat transfer. the topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. these protective coatings prevent damage to the junction and the anode air - bridge during handling and assembly. applications these packageless devices are suitable for moderate incident power applications, 10w/c.w. or where the peak power is 52w, pulse width is 1 s, and duty cycle is 0.01%. their low parasitic inductance, 0.4 nh, and excellent rc constant , make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts. inches mm dim min max min max a 0.040 0.042 1.025 1.075 b 0.021 0.023 0.525 0.575 c 0.004 0.008 0.102 0.203 d 0.013 0.015 0.325 0.375 e 0.011 0.013 0.275 0.325 f 0.013 0.015 0.325 0.375 g 0.019 0.021 0.475 0.525 parameter absolute maximum madp - 042 - 13060 308 408 508 908 c.w. incident power dbm +42 +44 +43 +39 forward current 250 ma reverse voltage - 100 v operating temperature - 55c to +125c storage temperature - 55c to +150c junction temperature +175c mounting temperature +280c for 10 seconds absolute maximum ratings 1 @ t amb = +25c (unless otherwise specified) 1. exceeding these limits may cause permanent damage. g d e f notes: 1. backside metal: 0.1 m thick. 2. yellow hatched areas indicate backside ohmic gold contacts. 3. all devices have the same outline dimensions ( a to g).
2 surmount tm 8 m pin diodes rohs compliant rev. v1 madp - 042xx8 - 13060 series advanced: data sheets contain information regarding a product m/a - com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a - com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. m/a - com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. specifications subject to change without notice . electrical specifications @ t amb = + 25 c parameter symbol conditions madp - 042308 - 13060 madp - 042508 - 13060 units typ max typ max capacitance c t 1,3 - 10v, 1 mhz 1 pf 0.10 0.20 0.18 0.30 capacitance c t 1,3 - 10 v, 1 ghz 1,3 pf 0.10 0.19 capacitance c t 1,3 - 40 v, 1 mhz 1 pf 0.09 0.20 0.18 0.30 capacitance c t 1,3 - 40 v, 1 ghz 1,3 pf 0.10 0.18 resistance r s 2,3 + 20 ma, 1 ghz 2,3 w 1.38 0.97 resistance r s 2,3 + 50 ma, 1 ghz 2,3 w 1.18 0.87 forward voltage v f + 10 ma v 0.85 1.00 0.82 1.00 reverse leakage current i r - 100v a 10 10 input third order intercept point iip 3 f 1= 1000 mhz f2 = 1010 mhz input power = +20 dbm i bias = + 20 ma dbm 73 77 c.w. thermal resistance c/w 145 115 lifetime t l +10 ma / - 6 ma ( 50% - 90% v ) ns 280 310 parameter symbol conditions units madp - 042408 - 13060 madp - 042908 - 13060 typ. max typ max capacitance c t 1,3 - 10 v, 1 mhz 1 pf 0.38 0.50 0.05 0.15 capacitance c t 1,3 - 10 v, 1 ghz 1,3 pf 0.39 0.05 capacitance c t 1,3 - 40 v, 1 mhz 1 pf 0.36 0.50 0.04 0.15 capacitance c t 1,3 - 40 v, 1 ghz 1,3 pf 0.37 0.05 resistance r s 2,3 + 20 ma, 1 ghz 2,3 w 0.67 3.63 resistance r s 2,3 + 50 ma, 1 ghz 2,3 w 0.61 3.02 forward voltage v f + 10 ma v 0.80 1.00 0.91 1.00 reverse leakage current i r - 100v a 10 10 input third order intercept point iip 3 f 1= 1000 mhz f2 = 1010 mhz input power = +20 dbm i bias = + 20 ma dbm 81 66 c.w. thermal resistance 4 c/w 100 185 lifetime t l +10 ma / - 6 ma ( 50% - 90% v ) ns 380 230 1. total capacitance, c t , is equivalent to the sum of junction capacitance ,c j , and parasitic capacitance, cpar. 2. series resistance r s is equivalent to the total diode resistance : r s = r j ( junction resistance) + r c ( ohmic resistance) 3. r s and c t are measured on an hp4291a impedance analyzer with die mounted in an ods - 1134 package. 4. theta ( ) is measured with the die mounted in an ods - 1134 package.
3 surmount tm 8 m pin diodes rohs compliant rev. v1 madp - 042xx8 - 13060 series advanced: data sheets contain information regarding a product m/a - com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a - com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. m/a - com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. typical performance @ t amb = +25 c ct @ 10v 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 freq (ghz) ct (pf) 042408 042508 042308 042908 ct @ 1ghz 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0 5 10 15 20 25 30 35 40 bias (v) ct (pf) 042408 042508 042308 042908 ct @ 40v 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 freq (ghz) ct (pf) 042408 042508 042308 042908 rs @ 1ghz 0.100 1.000 10.000 0.001 0.010 0.100 bias (a) rs (ohm) 042408 042508 042308 042908 rs @ 10ma 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 freq (ghz) rs (ohm) 042908 042308 042508 042408 rs @ 20ma 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 freq (ghz) rs (ohm) 042908 042308 042508 042408
4 surmount tm 8 m pin diodes rohs compliant rev. v1 madp - 042xx8 - 13060 series advanced: data sheets contain information regarding a product m/a - com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a - com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. m/a - com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. handling procedures all semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. the use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. bulk handling should insure that abrasion and mechanical shock are minimized. bonding techniques attachment to a circuit board is made simple through the use of surface mount technology. mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. these devices are well suited for solder attachment onto hard and soft substrates. the use of 80au/20sn, or rohs compliant solders is recommended. for applications where the average power is ~1w, conductive silver epoxy may also be used. cure per manufacturers recommended time and temperature. typically 1 hour at 150c. when soldering these devices to a hard substrate, hot gas die bonding is preferred. a vacuum tip pick - up tool and a force of 60 to100 grams applied to the top surface of the device is recommended. when soldering to soft substrates, such as duroid, it is recommended to use a soft solder at the circuit board to mounting pad interface. position the die so that its mounting pad s are aligned with the circuit board mounting pads. while applying a downward force perpendicular to the top surface of the die , apply heat near the circuit trace and diode mounting pad. the solder connection to the two pads should not be made one at a time as this will create unequal heat flow and thermal stress to the part. solder reflow should not be performed by causing h eat to flow through the top surface of the die to the back. since the hmic glass is transparent, the edges of the mounting pads can be visually inspected through the die after attachment is completed. typical re - flow profiles for sn60/pb40 and rohs compliant solders is provided in application note m538 , surface mounting instructions and can viewed on the ma - com techs website @ www.macomtech.com ordering information the madp - 042xx8 - 13060 series of surmounts may be ordered in either gel packs or tape and reeled by adding the appropriate suffix per the table below. tape and reel dimensions are provided in application note m513 located on the m/a - com website @ www.macomtech.com . part number gel pack tape and reel (surf tape) tape and reel (pocket tape) madp - 042308 - 13060g madp - 042308 - 13060t madp - 042308 - 13060p madp - 042408 - 13060g madp - 042408 - 13060t madp - 042408 - 13060p madp - 042508 - 13060g madp - 042508 - 13060t madp - 042508 - 13060p madp - 042908 - 13060g madp - 042908 - 13060t madp - 042908 - 13060p
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